[en] The primary goal of the sensor suite is to provide an internal 3D map of the HCAEX tunnel. When looking for a sensor that would provide XYZ point cloud data for mapping the decision was between a stereo camera, a 3D Lidar, or a 2D Lidar that would need to be spun around. The issues with the stereo camera were that it does not have a large field-of-view and that its depth information was not nearly as accurate as even the baseline Lidars. The selection between Lidars is detailed. The Hokuyo UTM-30LX-EW shown provides a 270 deg. FOV with high accuracy and resolution while the largest FOV on a 3D Lidar is 40 deg.. This was the reason a 2D Lidar was chosen over the 3D Lidar. Even though the 2D Lidar requires additional components and software to generate a 3D map, its FOV advantage is too great given that the HCAEX tunnel is a relatively confined space. The rotating planar scan from the 2D Lidar can be stitched into a 3D scan as shown in the graphic below. Along with XYZ data, the Lidar provides return intensity data in color which can be used to distinguish between different materials within the tunnel. To provide visual feedback a camera system needed to be identified. The common solution for this is a high resolution camera with a small FOV mounted on a pan-tilt system. But, given the critical nature of the visual feedback we looked into solutions without the need for moving parts. Two panospheric cameras give a FOV large enough to get a full 360 deg. view.. Camera color data (RGB) can also be combined with the 3D mapping data from the Lidar and overlaid on the map to give the user the ability to see inside the entire length of the tunnel as if they were inside. Situational awareness is required for the crawler in the tunnel in order for it to be able to register the 3D scans to create a final map. For this we procured a Microstrain 3DM-GX5-25 Inertial Measurement Unit (IMU). To perform the Lidar rotation we have two servos driving the pan and tilt. The servo controls and most data processing will be performed via an onboard computer. The sensor components are to be packaged together using 3D printed mounts into a standalone unit